Before welding, the aluminum foil Mylar needs to be peeled off by laser. If there are still various impurities and pollutants on the aluminum foil, it will seriously affect the subsequent welding of metal parts such as terminals, copper sheets and the aluminum foil, and ultimately affect the accuracy and performance of the product test. efficient…… Part 1 The composition of high-speed cables High-speed cable (Direct Attach Cable) is abbreviated as DAC (common DAC high-speed cable classification and model), generally translated as direct connection cable or direct connection copper cable, using silver-plated copper conductor and foamed insulated core wire as the material, using a separate wire The way of shielding and total shielding constitutes a high-speed cable. The cable composition structure is mainly divided into four layers:   DAC level one C...

At the end of November 2017, the HDMI 2.1 standard was officially released. Now more than three years have passed, and related equipment is constantly emerging. Of course, they are all high-end products. You cannot expect them to spread to the mass market.   Today, the HDMI Forum officially announced the launch of a new "Ultra High Speed ​​HDMI 2.1 Cables" (Ultra High Speed ​​HDMI 2.1 Cables) mandatory certification program, which can fully support all the features of HDMI 2.1 and output all functions from the source device to the display. .   This includes: 4K120Hz/8K60Hz lossless video, dynamic HDR, eARC (audio return channel), VRR (variable refresh rate), QMS (fast media switching), QFT (fast frame transfer), ALLM (automatic low latency mode) ,and many more.   In fact, this kind of ultra-high-speed data cab...

This article is transferred from [cnBeta.COM]; Recently, researchers have successfully developed a new data transmission system that pairs high-frequency silicon chips with hair-thin polymer cables to achieve information transmission speeds 10 times faster than USB. The system may one day improve the energy efficiency of data centers and reduce the load on electronic components.   This research was published at the IEEE International Conference on Solid-State Circuits in February this year. The main author is Jack Holloway '03, MNG '04. He completed his PhD in the Department of Electrical Engineering and Computer Science (EECS) at the Massachusetts Institute of Technology last fall. Degree, currently working in Raytheon Company. Co-authors include Ruonan Han, Holloway's PhD supervisor and associate professor at EECS, and Georgi...