QSFP-DD 400G 30AWG-14P+26AWG-2P

QSFP-DD is mainly used for Ethernet switches, enabling interconnection between switches or servers It uses 8 channels and can run up to 50Gbps PAM4 modulation, providing a solution of up to 400Gbps aggregation, which can be achieved in a single switch slot 14,4Tbps aggregate bandwidth and solve the problem of rapid growth of data center traffic

 

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Overview: SAS (Serial Attached SCSI), also known as Serial Attached SCSI, is a new generation of SCSI technology, like the current popular Serial ATA (SATA) hard drives, uses serial technology to achieve higher transmission speeds and improves internal space by shortening connection lines. For raw wires, mainly distinguished based on electrical performance, divided into 6G and 12G, and SAS4.0 24G. However, the mainstream production process is still basically the same. For SAS high-frequency lines, impedance, attenuation, loop loss, and crosstalk are the most important transmission indicators. The operating frequency of SAS high-frequency lines is generally above 2.5GHz. High frequency and low loss communication cables are generally made of foam-polyethylene or foam-polypropylene as insulation materials. Two insulated core wires and two ground wires enter the wrapping machine, and aluminum foil and adhesive polyester tape are wrapped around the insulated core wires and ground wires, insulation process design and process control, structure, electrical performance requirements, and transmission theory of high-speed transmission lines.

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Cable Construction
Section Item Hibest's requirement
Insulation1 Conductor
"26AWG 1/0.425±0.005mm
Silver Plated Copper"
Insulation PP
Thickness 0.30mm Nom./0.25mm Min
OD 1.42±0.03mm
Color Transparent
Insulation2 Conductor
"30AWG 1/0.28±0.005mm
Silver Plated Copper"
Insulation PP
Thickness 0.30mm Nom./0.25mm Min
OD 0.92±0.03mm
Color Transparent
Tape1 Drain
26AWG 1/0.404±0.005mm Tinned Copper
Material 1 10mmBlue AL foil&Hot melt Mylar0.015*6mm
Printing 2P Print:A01、A02
Tape1 Drain 30AWG 1/0.26±0.005mm Tinned Copper
Material 6mmBlue AL foil&Hot melt Mylar0.015*4mm
Printing 14P Print:A03、A04---A16
"Core 
stranding"
stranding 1 A01-A02Transparent Mylar 0.015*12mm Pitch:300mm
stranding 2
"A01-A02Transparent Mylar0.015*12mm 
Pitch:300mm"
stranding 3
"Stranding 2+A08/09/10/11/12/13/14/15/16 
Mylar0.015*24mm  AL foil 0.025*24mm Pitch:300mm"
Braid Material
"24*10/0.12±0.005mm Tinned Copper 
Braid Copper Coverage 85%"
OD 8.30±0.3mm
Jacket Material 60P PVC
Thickness 0.4mm Min AVG/0.30mm Min
OD
9.70±0.10mm
Color Black



Ⅱ.Physical Characteristics  

1. PP Insulation:Before aging:Tensile strength 3000PSI Min  Elongation:150% Min
2. PVC Insulation:Before aging:Tensile strength 1500PSI Min  Elongation:100% Min

 

Ⅲ.Printing:  

 30AWG*28C+26AWG*4C  HiBest uLDc®    www.hibest.com.cn

 

Ⅳ.Electrical Characteristics 

1.Conductor Resistance:354 Ohms/km Max@20℃
2.Differential impedance:100±5 Ohm@TDR 30ps risetime(20%~80%)
3.Intra-pair Skew 100ps risetime(20%~80%):≤10ps/Cable
4.Attenuntion SDD21:
-4.64dB/m Max.@12.5 MHz
-4.64dB/m Max.@1250 MHz
-6.74dB/m Max.@2500 MHz
-9.47dB/m Max.@5000 MHz
-11.6dB/m Max.@7000 MHz
-14.4dB/m Max.@10000 MHz
-17.1dB/m Max.@12890 MHz
-19.2dB/m Max.@15000 MHz
-22.3dB/m Max.@18000 MHz
-24.7dB/m Max.@20000 MHz
5.Diff To Comm_Convert SCD21:
-22dB/m Max.@12.5-20000 MHz
6.Return Loss SDD11&SDD22:
-16.05dB/m Max.@12.5 MHz
-12.5dB/m Max.@4100 MHz
-2.81dB/m Max.@20000 MHz
7.Withstand Voltage:300V/DC
8.Insulation Resistance:﹥300M Ohm

 

Ⅴ.Products meet environmental requirements

 

Ⅵ.Packing 

 
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